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Reliability Engineer - Mac SoC Package Integration

  2025-06-05     Apple, Inc.     Austin,TX  
Description:

Reliability Engineer - Mac SoC Package Integration

Do you ever wonder what goes into making Apple products an amazing user experience? The engineers on Apples innovative reliability team are responsible for ensuring that our products exceed our customers expectations for robustness, durability, and reliability. We are looking for dedicated contributors who enjoy working on revolutionary products and aspire to make them better through the creation and execution of comprehensive test suites, identification of potential failure modes, and collaboration with design teams to drive product improvements. The position is on Apples innovative Mac Reliability Engineering team, where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board-level reliability on new Mac products.

Description

As Reliability Engineer - Mac SoC Package Integration, you will be responsible for the following:

  • Lead board-level reliability for advanced Apple SoC packages in Mac systems.
  • Research emerging technologies and use FMEA to identify, categorize, and mitigate failure modes.
  • Apply physics-of-failure principles to deepen failure mode understanding.
  • Drive issues to resolution through rigorous root cause analysis.
  • Perform statistical data analysis to provide risk assessments of a design.
  • Prepare concise and detailed test plans and test reports.
  • Prioritize and complete tasks to meet deadlines.
  • Provide design input to improve product reliability when necessary.
  • Interact with a wide variety of individuals and teams to communicate results.
Minimum Qualifications
  • BS in Materials Science, Electrical, Mechanical Engineering, or an equivalent field desired.
  • 3+ years relevant engineering experience.
  • Knowledge of Semiconductor package integration, SLI (Second Level Interconnect) reliability, passive components reliability, PCB reliability, bonding materials, and warpage control.
  • Proven experience in failure modes, life data analysis, and ALT (Accelerated Life Test) methodologies.
  • Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing.
  • Application of FMEA (Failure Modes and Effects Analysis).
Preferred Qualifications
  • MS or PhD in Materials Science, Electrical, Mechanical Engineering, or an equivalent field desired.
  • Semiconductor packaging and board reliability background.
  • Experience in reliability data analysis and application of ALT models.
  • Failure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc).
  • Knowledge of industry test standards (JEDEC, ASTM, IEEE).
  • Dynamic and can do attitude with a desire to work with a great team and product.
  • Record of initiating innovation and continuous improvement.
  • Exceptional problem-solving abilities, and strong attention to detail.
  • Excellent written and verbal communication skills.
  • Ability to manage multiple projects at the same time.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

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